In today’s connected world, understanding the myriad of physics behind your electronics is paramount for performance, reliability, and differentiation from your competitors. Whether its signal integrity, antenna design, heat transfer, electro-mechanical, or circuit layout, optimizing today’s electronics requires a true multi-physics approach.
Backed by 25 years of product development and simulation consulting, Boston Engineering provides Ansys software and support, Ansys training, and simulation / product development consulting. With Boston Engineering, clients can scale quickly to address their evolving product development and engineering simulation requirements through consulting and tools.
Electromagnetics Simulation Software
Ansys’ robust simulation software suite covers electronics design and analysis.
Low Frequency Electromagnetics – Ansys Maxwell is the industry leader for electromagnetic field simulation. With automatic meshing, and a multi-domain, multi-physics approach, the complex, dynamic motion of electromechanical devices such as motors, actuators, relays, and solenoids can be fully characterized and optimized prior to the first prototype. Maxwell includes a comprehensive set of solvers for AC and DC voltage applications as well as static, transient, and rigid motion analysis.
High Frequency Electromagnetics – With the rise of 5G technology, analysis of the 3D electromagnetic field around electronics is critical to ensure high performance and reliability. Ansys HFSS is the industry leader for simulating antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, and connectors. Coupled with high-performance computing (HPC) and optimetrics, the design of experiments can be simulated to optimize advanced high frequency electromagnetic designs such as a phased array antenna for military applications.
RLCG Extraction – Through accurate electromagnetic field simulation, Ansys Q3D extractor creates a SPICE model by extracting the proper resistance, inductance, capacitance and conductance (RLCG) parameters. This means that electronic devices like integrated circuits (IC’s) and high density printed circuit boards (PCBs) can be easily optimized for high frequency signal integrity performance such as reducing crosstalk and ground bounce.
Electronics Thermal Analysis – Understanding the heat transfer due to conduction, convection and radiation is critical at every level. Ansys Icepak can analyze ECAD/MCAD geometry at any scale – whether it is at the component, board, or system level.
Power & Signal Integrity Analysis – To optimize power and signal integrity, Ansys SIWave allows the analysis of integrated circuits (ICs) and printed circuit boards (PCBs) for electromagnetic interference (EMI). With multi-scale (die, chip, package, board) capability, and direct connections to Ansys’ structural and thermal capabilities, true electronic reliability can be predicted, and ultimately maximized.
Semiconductor Simulation Software
Semiconductor Analysis – To maximize the signal-to-noise ratio at the integrated circuit (IC) level, Ansys provides a full product suite including:
- RedHawk: multiscale power integrity
- Totem: transistor-level power noise
- PowerArtist: RTL design & analysis
- RaptorX: Pre-LVS electromagnetic modeling
- Exalto: post-LVS RLCk extraction software
Optics Simulation Software
Light Simulation (Optics) – Ansys SPEOS addresses physics-based imaging, photonic, and illumination challenges. Whether it’s for displays, interior lighting, or autonomous vehicle sensors, SPEOS enables lighting designers to reduce the number of costly prototypes, and takes the subjectivity out of how your product “looks.”
Boston Engineering has the Ansys training to fit your team’s schedule and requirements. Simulation education options include curriculum-based classroom training; self-paced, web-based training; and custom knowledge management programs for advanced users. We provide certified training for Ansys software throughout New England, New Jersey, and New York. Contact us for more information.